Chemical-mechanical polishing pad providing polishing unformity

Abrading – Abrading process – Glass or stone abrading

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Details

451532, 451 36, 451449, B24B 100, B23D 1100

Patent

active

055339239

ABSTRACT:
In accordance with the present invention, a polishing pad useful for polishing a semiconductor-comprising substrate is disclosed. The polishing pad is constructed to include conduits which pass through at least a portion of and preferably through the entire thickness of the polishing pad. The conduits, preferably tubulars, are constructed from a first material which is different from a second material used as a support matrix. The conduits are positioned within the support matrix such that the longitudinal centerline of the conduit forms an angle ranging from about 60.degree. to about 120.degree. with the working surface of the polishing pad. In the most preferred embodiment of the present invention, the conduits pass all the way through the thickness of the polishing pad and are sized to permit the flow of polishing slurry, reactive etchant material, heat transfer medium, and/or lubricant from a supply device through the conduits to the working surface of the polishing pad (at least a portion of which is in contact or near contact with the article to be polished).

REFERENCES:
patent: 5020283 (1991-06-01), Tuttle
patent: 5177908 (1993-01-01), Tuttle
patent: 5300188 (1994-04-01), Tessmer et al.

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