Chemical-mechanical polishing of thin materials using a pulse po

Details Chemical-mechanical polishing of thin materials using a pulse po Chemical-mechanical polishing of thin materials using a pulse po

1995-02-06

1996-01-23

Silverberg, Sam

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

216 88, 451287, H01L 21304

Patent

active

054862655

ABSTRACT:
Uniform chemical-mechanical planarization is achieved at a high material removal rate by pulsing the pressure applied to the wafer undergoing planarization between an initial optimum pressure and a reduced second pressure, preferably about 0 psi.

REFERENCES:
patent: 3841031 (1974-10-01), Walsh
patent: 3911562 (1975-10-01), Youmans
patent: 4193226 (1980-03-01), Gill, Jr. et al.
patent: 4811522 (1989-03-01), Gill, Jr.
patent: 4944836 (1990-07-01), Beyer et al.
patent: 5069002 (1991-12-01), Sandhu
patent: 5081795 (1992-01-01), Tanaka
patent: 5245794 (1993-09-01), Salugsugan

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