Chemical mechanical polishing of a metal layer with...

Details Chemical mechanical polishing of a metal layer with... Chemical mechanical polishing of a metal layer with...

2005-03-22

2005-03-22

Thomas, David B. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S008000, C451S011000, C451S041000, C438S005000

Reexamination Certificate

active

06869332

ABSTRACT:
A method of chemical mechanical polishing a metal layer on a substrate in which the substrate is polished at a first polishing rate. Polishing is monitored with an eddy current monitoring system, and the polishing rate is reduced to a second polishing rate when the eddy current monitoring system indicates that a predetermined thickness of the metal layer remains on the substrate. Then polishing is monitored with an optical monitoring system, and polishing is halted when the optical monitoring system indicates that an underlying layer is at least partially exposed.

REFERENCES:
patent: 4005359 (1977-01-01), Smoot
patent: 4112365 (1978-09-01), Larson et al.
patent: 4303885 (1981-12-01), Davis et al.
patent: 4467281 (1984-08-01), Davis et al.
patent: 4556845 (1985-12-01), Strope et al.
patent: 4715007 (1987-12-01), Fujita et al.
patent: 4716366 (1987-12-01), Hosoe et al.
patent: 4829251 (1989-05-01), Fischer
patent: 5003262 (1991-03-01), Egner et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5213655 (1993-05-01), Leach et al.
patent: 5237271 (1993-08-01), Hedengren
patent: 5340370 (1994-08-01), Cadien
patent: 5343146 (1994-08-01), Koch et al.
patent: 5355083 (1994-10-01), George et al.
patent: 5357331 (1994-10-01), Flockencier
patent: 5413941 (1995-05-01), Koos et al.
patent: 5427878 (1995-06-01), Corliss
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5541510 (1996-07-01), Danielson
patent: 5559428 (1996-09-01), Li et al.
patent: 5605760 (1997-02-01), Roberts
patent: 5609511 (1997-03-01), Moriyama et al.
patent: 5640242 (1997-06-01), O'Boyle et al.
patent: 5658183 (1997-08-01), Sandhu et al.
patent: 5660672 (1997-08-01), Li et al.
patent: 5663797 (1997-09-01), Sandhu
patent: 5664221 (1997-09-01), Amberg et al.
patent: 5672091 (1997-09-01), Takahashi et al.
patent: 5676587 (1997-10-01), Landers et al.
patent: RE35703 (1997-12-01), Koch et al.
patent: 5708506 (1998-01-01), Birang
patent: 5730642 (1998-03-01), Sandhu et al.
patent: 5731697 (1998-03-01), Li et al.
patent: 5733171 (1998-03-01), Allen et al.
patent: 5762537 (1998-06-01), Sandhu et al.
patent: 5791969 (1998-08-01), Lund
patent: 5838447 (1998-11-01), Hiyama et al.
patent: 5851135 (1998-12-01), Sandhu et al.
patent: 5865666 (1999-02-01), Nagahara
patent: 5872633 (1999-02-01), Holzapfel et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 5899792 (1999-05-01), Yagi
patent: 5949927 (1999-09-01), Tang
patent: 5964643 (1999-10-01), Birang et al.
patent: 6004187 (1999-12-01), Nyui et al.
patent: 6072313 (2000-06-01), Li et al.
patent: 6159073 (2000-12-01), Wiswesser et al.
patent: 6179709 (2001-01-01), Redeker et al.
patent: 6190234 (2001-02-01), Swedek et al.
patent: 6280289 (2001-08-01), Wiswesser et al.
patent: 6296548 (2001-10-01), Wiswesser et al.
patent: 6558229 (2003-05-01), Kimura et al.
patent: 6595831 (2003-07-01), Hirokawa et al.
patent: 6602724 (2003-08-01), Redeker et al.
patent: 6663469 (2003-12-01), Kimura et al.
patent: 6707540 (2004-03-01), Lehman et al.
patent: 20020013007 (2002-01-01), Hassagawa et al.
patent: 0 460 348 (1992-03-01), None
patent: 0 663 265 (1995-07-01), None
patent: 0 738 561 (1996-10-01), None
patent: 0 881 040 (1998-12-01), None
patent: 0 881 484 (1998-12-01), None
patent: 1 116 552 (2001-07-01), None
patent: 3-234467 (1991-10-01), None
patent: WO 0146684 (2000-12-01), None

Affiliated with

Also associated with

Rating

Chemical mechanical polishing of a metal layer with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical mechanical polishing of a metal layer with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical mechanical polishing of a metal layer with... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3387165