Chemical mechanical polishing method suitable for highly accurat

Details Chemical mechanical polishing method suitable for highly accurat Chemical mechanical polishing method suitable for highly accurat

1998-09-28

2000-10-17

Eley, Timothy V.

Abrading

Abrading process

Utilizing fluent abradant

451 41, 451 59, 216 88, 438692, B24B 100

Patent

active

06132292&

ABSTRACT:
A method of forming interconnection layers within grooves of an insulating layer. The method includes the steps of: forming grooves in an upper portion of an insulating layer; depositing a conductive layer over a surface of the insulating layer and also within the grooves; and subjecting the conductive layer to a chemical mechanical polishing for polishing the conductive layer, so as to leave the conductive layer only within the grooves, thereby forming interconnection layers in the grooves. The chemical mechanical polishing is carried out by use of a polishing pad having a polyurethane foam polishing pad surface at a down pressure of no more than 420 gwt/cm.sup.2.

REFERENCES:
patent: 5899792 (1999-05-01), Yagi
patent: 5916016 (1999-06-01), Bothra
patent: 5924916 (1999-06-01), Yamashita
patent: 5976000 (1999-11-01), Hudson

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