Chemical-mechanical polishing method and apparatus using ultraso

Details Chemical-mechanical polishing method and apparatus using ultraso Chemical-mechanical polishing method and apparatus using ultraso

1995-12-19

1997-11-18

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 1566451, 216 88, 451165, 451287, H01L 21306

Patent

active

056883641

ABSTRACT:
There is provided a chemical-mechanical polishing method and apparatus ensuring excellent polishing rate and flattening characteristics for flattening level different areas on interlayer insulating film generated in the manufacturing process of a semiconductor device. Polishing is performed while ultrasonic wave vibration is being applied to a processing substrate. The ultrasonic wave vibration applying means are mounted on the carrier and platen. Thereby, since polishing is performed while using the ultrasonic wave energy in addition to the conventional chemical-mechanical polishing method, polishing rate can be much improved. Moreover, since the slurry is supplied sufficiently without relation to pattern density and areas of the level different areas, uniform and flat surface not depending on the pattern can be obtained.

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