Chemical mechanical polishing machine

Details Chemical mechanical polishing machine Chemical mechanical polishing machine

1998-12-04

2000-08-01

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

451287, 451288, 438693, C23F 102

Patent

active

060961627

ABSTRACT:
A CMP machine includes several polishing tables mounted on a carousel, which rotates in one direction. Each of the polishing tables includes a polishing pad. Each polishing pad can polish one wafer on its first surface. Each polishing pad also has one distributing duct used to supply slurry onto the polishing pad. An exhaust duct is included to exhaust slurry, in which the exhaust duct has a first end and a second end. The first end of the exhaust duct is coupled to slurry. A regulating valve is included to regulate slurry exhaust. An exhaust pump is included to produce a exhausting force of slurry. The exhaust pump is coupled to the second end of the exhaust duct. A regulating valve controller is included to control the regulating valve.

REFERENCES:
patent: 5658185 (1997-08-01), Morgan, III et al.
patent: 5922620 (1999-07-01), Shimomura et al.

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