Chemical mechanical polishing composition

Details Chemical mechanical polishing composition Chemical mechanical polishing composition

2006-06-19

2009-06-23

Nadine, Norton (Department: 1792)

Compositions

Heat-exchange, low-freezing or pour point, or high boiling...

Organic components

C252S079100, C216S013000, C216S106000, C438S690000, C438S691000, C438S692000, C438S693000

Reexamination Certificate

active

07550092

ABSTRACT:
A chemical mechanical polishing composition includes: an abrasive component, a corrosion inhibitor, a surfactant, a diacid compound, a metal residue inhibitor, and water. The metal residue inhibitor is selected from the group of compounds having the following formulas:and combinations thereof,wherein R1, R2, R3, and R4are independently selected from H, C1-C6alkyl, C2-C6alkenyl, and C2-C6alkylidyne; and R5, R6, R7, R8, R9, and R10are independently selected from H and C1-C6alkyl.

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