Compositions – Etching or brightening compositions
Reexamination Certificate
2007-09-11
2007-09-11
Deo, Duy-Vu N. (Department: 1765)
Compositions
Etching or brightening compositions
C252S079200, C051S307000, C051S308000, C210S631000
Reexamination Certificate
active
11447212
ABSTRACT:
Compositions and methods for planarizing or polishing a surface, particularly a semiconductor wafer surface. The polishing compositions described herein comprise (a) a liquid carrier; (b) purified clay; and optional additives, such as (c) a chemical accelerator; and (d) a complexing or coupling agent capable of chemically or ionically complexing with, or coupling to, the metal and/or insulating material removed during the polishing process. The complexing or coupling agent carries away the removed metal and/or silicon dioxide insulator particles, during polishing, to prevent the separated particles from returning to the surface from which they were removed. Also disclosed are methods of planarizing or polishing a surface comprising contacting the surface with the compositions.
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Eisenhour Don
Fang Mingming
Ianiro Michael R.
AMCOL International Corporation
Deo Duy-Vu N.
George Patricia A.
Marshall & Gerstein & Borun LLP
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