Chemical-mechanical polishing apparatus with slurry removal syst

Details Chemical-mechanical polishing apparatus with slurry removal syst Chemical-mechanical polishing apparatus with slurry removal syst

1995-10-25

1997-08-19

Eley, Timothy V.

Abrading

Abrading process

Utilizing fluent abradant

451 41, 451 60, 451 87, 451288, 451290, 451446, 438693, B24B 100, B24C 900

Patent

active

056581858

ABSTRACT:
An apparatus and method for improving planarity of chemical-mechanical polishing of substrates are provided. The apparatus includes a platen having a planar surface upon which a polishing pad is removably affixed. The pad has an exposed planar surface, and a carrier removably holds the substrate against the planar surface. The apparatus includes a slurry distribution system and a slurry removal system. The slurry distribution system provides slurry to an instantaneous interface area of the substrate and planar surface through the platen and pad, while the slurry removal system removes slurry from the instantaneous interface area through the pad and the platen, notwithstanding rotation of the platen and/or substrate, as well as linear movement of the substrate relative to the rotating platen.

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patent: 5329734 (1994-07-01), Yu
patent: 5554064 (1996-09-01), Breivogel et al.

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