Chemical mechanical polishing apparatus with improved carrier an

Details Chemical mechanical polishing apparatus with improved carrier an Chemical mechanical polishing apparatus with improved carrier an

1995-05-01

1997-04-29

Rose, Robert A.

Abrading

Abrading process

451388, 451397, 451285, 451286, 451287, 451288, 451289, B24B 100

Patent

active

056242999

ABSTRACT:
A carrier apparatus for positioning and biasing a substrate against a polishing pad. The carrier apparatus includes a resilient membrane which loads the substrate against the pad. The membrane is configured to create one or more vacuum regions which chuck the substrate to the membrane so that the carrier may move the substrate on and off the polishing pad. In addition, the membrane may be pressurized to dechuck the substrate and allow the substrate to be front loaded or to float on the polishing pad. A retaining ring is directly adhered to the membrane to define a substrate receiving portion of the membrane. The retaining ring limits twisting of the membrane with respect to the substrate. In addition, the membrane is protected from the polishing pad by a right angled and annular shield. The membrane has a circumferential dimple expansion member prevent the center of the membrane from doming during the polishing process.

REFERENCES:
patent: 4669226 (1987-06-01), Mandler
patent: 4918869 (1990-04-01), Kitta
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5193316 (1993-03-01), Olmstead
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5230184 (1993-07-01), Bukhman
patent: 5255474 (1993-10-01), Gawa et al.
patent: 5423716 (1995-06-01), Strasbaugh
patent: 5441444 (1995-08-01), Nakajima
patent: 5476414 (1995-12-01), Hirose et al.

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