Chemical mechanical polishing apparatus

Details Chemical mechanical polishing apparatus Chemical mechanical polishing apparatus

2005-05-03

2005-05-03

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S285000

Reexamination Certificate

active

06887130

ABSTRACT:
A chemical mechanical polishing (CMP) apparatus includes a plate that holds a substrate, a pad assembly unit comprising a pad support device, a positioning device, and a rotation device operatively connected to the pad assembly unit. The pad support device comprises a plurality of support plates to which pad pieces of a polishing pad can be attached. The positioning device can move at least one of the plurality of support plates in a direction along a surface of the semiconductor substrate to be polished. Further, the CMP apparatus can control the polishing amount along any portion of a surface of a wafer to be polished.

REFERENCES:
patent: 5934979 (1999-08-01), Talieh

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