Abrading – Precision device or process - or with condition responsive... – With indicating
Reexamination Certificate
2006-08-07
2011-10-18
Rachuba, Maurina (Department: 3727)
Abrading
Precision device or process - or with condition responsive...
With indicating
C451S056000, C451S285000
Reexamination Certificate
active
08038509
ABSTRACT:
Disclosed herein is a chemical mechanical polishing apparatus. The apparatus comprises a carrier to hold a wafer and being capable of lifting, lowering and rotating, a polishing pad compressed onto the wafer through the lowering of the carrier to polish the wafer, a contact pressure sensor to detect contact pressure between the polishing pad and the wafer when the polishing pad is compressed onto the wafer, a support physical property controller to generate control signals corresponding to the contact pressure detected by the contact pressure sensor, a variable physical property support being adapted to come into close contact with the polishing pad and having physical properties varied in response to the control signals generated by the support physical property controller, and a rotational table to hold the variable physical property table.
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Drinker Biddle & Reath LLP
Rachuba Maurina
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