Chemical/mechanical polish (CMP) thickness monitor

Details Chemical/mechanical polish (CMP) thickness monitor Chemical/mechanical polish (CMP) thickness monitor

1996-05-23

1997-07-01

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 5, 451 6, 451 7, 451 8, 451287, 451288, 451289, 451 41, 451 53, B24B 4900, B24B 5100

Patent

active

056430507

ABSTRACT:
An improved and new process for chemical/mechanical planarization (CMP) of a substrate surface, wherein the removed layer thickness is detected, in-situ, without necessity to remove the substrate from the polishing apparatus has been developed. The method comprises monitoring the temperature of the polishing pad or the polished substrate versus polishing time, integrating the polishing temperature change versus polish time curve with polish time, and applying computer stored integration coefficients to the integrated area to derive the removed thickness.

REFERENCES:
patent: 4351029 (1982-09-01), Maxey et al.
patent: 4471579 (1984-09-01), Bovensiepen
patent: 5113622 (1992-05-01), Nishiguchi et al.
patent: 5127196 (1992-07-01), Morimoto et al.
patent: 5196353 (1993-03-01), Sandhu et al.
patent: 5234868 (1993-08-01), Cote
patent: 5240552 (1993-08-01), Yu et al.
patent: 5308438 (1994-05-01), Cote et al.
patent: 5337015 (1994-08-01), Lustig et al.
patent: 5413941 (1995-05-01), Koos et al.
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5575706 (1996-11-01), Tsai et al.
patent: 5595526 (1997-01-01), Yau et al.

Affiliated with

Also associated with

Rating

Chemical/mechanical polish (CMP) thickness monitor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical/mechanical polish (CMP) thickness monitor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical/mechanical polish (CMP) thickness monitor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-591396