Chemical-mechanical polish (CMP) pad conditioner

Details Chemical-mechanical polish (CMP) pad conditioner Chemical-mechanical polish (CMP) pad conditioner

1996-05-28

1998-10-20

Eley, Timothy V.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 9, 451 41, 451285, B24B 4900, B24B 5100

Patent

active

058238549

ABSTRACT:
An improved and new apparatus and process for conditioning a chemical-mechanical polishing (CMP) pad has been developed, wherein sufficient conditioning is assured in order to restore the "fresh pad" polish removal rate performance of the polishing pad, while at the same time prolong the life of the CMP polishing pad. The result is a lower cost process and improved product throughput for the CMP apparatus.

REFERENCES:
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patent: 5132617 (1992-07-01), Leach et al.
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5310455 (1994-05-01), Pasch et al.
patent: 5320706 (1994-06-01), Blackwell
patent: 5481475 (1996-01-01), Young
patent: 5492594 (1996-02-01), Burke et al.
patent: 5562529 (1996-10-01), Kishii et al.
patent: 5575706 (1996-11-01), Tsai et al.
patent: 5637031 (1997-06-01), Chen

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