Chemical mechanical planarization (CMP) system and method...

Details Chemical mechanical planarization (CMP) system and method... Chemical mechanical planarization (CMP) system and method...

2006-07-18

2006-07-18

Rachuba, M. (Department: 3723)

Abrading

Machine

Rotary tool

C451S210000

Reexamination Certificate

active

07077731

ABSTRACT:
A method for preparing a wafer in a cleaning module is described. In this method, slurry is dispensed onto a surface of a wafer. Next, a chemical mechanical planarization (CMP) operation is conducted in the cleaning module by contacting a surface of a brush with the surface of the wafer. Subsequently, a cleaning operation is conducted in the cleaning module. A CMP pad and a CMP system also are described.

REFERENCES:
patent: 5868857 (1999-02-01), Moinpour et al.
patent: 6200201 (2001-03-01), Ravkin et al.
patent: 6328640 (2001-12-01), Jones et al.
patent: 6334229 (2002-01-01), Moinpour et al.
patent: 6616516 (2003-09-01), Ravkin et al.
patent: 6625835 (2003-09-01), Frost et al.
patent: 6837777 (2005-01-01), Ziemins et al.
patent: 2002/0173872 (2002-11-01), Malik

Affiliated with

Also associated with

Rating

Chemical mechanical planarization (CMP) system and method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical mechanical planarization (CMP) system and method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical mechanical planarization (CMP) system and method... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3546307