Chemical mechanical planarization (CMP) of a semiconductor wafer

Details Chemical mechanical planarization (CMP) of a semiconductor wafer Chemical mechanical planarization (CMP) of a semiconductor wafer

1991-12-11

1993-08-31

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156626, 437225, H01L 2100

Patent

active

052405524

ABSTRACT:
A method and apparatus for chemically mechanically planarizing (CMP) a semiconductor wafer includes directing acoustic waves at the wafer and receiving reflected acoustic waves from the wafer during the (CMP) process. By analyzing the acoustic waves and reflected acoustic waves a thickness of the wafer can be determined and an endpoint and thickness of films formed on the wafer can be monitored in real time during the (CMP) process. The process parameters of the (CMP) process can then be adjusted as required to improve the uniformity of the process.

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B. Davari et al., "Nondestructive Elvaluation of Generation . . . ", International Electron Devices Meeting 1983, Tech. Dig. Dec. 5-7, 1983, pp. 678-681.
W. Mechev et al, "Holographic Interferometric Monitoring . . . ", Instruments and Exp. Tech., vol. 25, No. 3, pt. 2, May-Jun. 1982, pp. 771-774.
S. Bhardway; B. T. Khuri-Yakub and K. C. Saraswat, Extended Abstract No. 790, "Acoustic Techniques for Thin Film Thickness Measurement in Semiconductor Processing" pp. 1164-1165, 1991 Fall Electrochemical Society Meeting (1991).

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