Chemical/mechanical planarization (CMP) apparatus and polish met

Details Chemical/mechanical planarization (CMP) apparatus and polish met Chemical/mechanical planarization (CMP) apparatus and polish met

1996-01-11

1996-11-19

Smith, James G.

Abrading

Abrading process

Glass or stone abrading

451285, 451 36, 216 88, 1566361, B24B 100

Patent

active

055757065

ABSTRACT:
An improved and new apparatus and process for chemical/mechanical planarization (CMP) of a substrate surface, wherein the slurry concentration between the wafer and polishing pad is controlled through the application of an electric field between the wafer carrier and polishing platen, has been developed. The result is an increased polish removal rate and better uniformity of the planarization process.

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patent: 5078801 (1992-01-01), Malik
patent: 5234867 (1993-08-01), Schultz et al.
patent: 5240552 (1993-08-01), Yu et al.
patent: 5272117 (1993-12-01), Roth et al.
patent: 5449313 (1995-09-01), Kordonsky et al.
patent: 5492594 (1996-02-01), Burke et al.

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