Chemical mechanical planarization apparatus

Details Chemical mechanical planarization apparatus Chemical mechanical planarization apparatus

2010-08-26

2011-11-15

Eley, Timothy V (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S067000, C451S451000

Reexamination Certificate

active

08057280

ABSTRACT:
A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.

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