Chemical etchant for palladium

Details Chemical etchant for palladium Chemical etchant for palladium

1993-12-29

1995-01-10

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156637, 156664, 252 795, B44C 122, C23F 100, C09K 1302

Patent

active

053804007

ABSTRACT:
A cyanide based aqueous solution for stripping palladium from copper-containing substrate. The solution includes a cyanide radical source compound, Na.sub.2 CO.sub.3, a nitrobenzoic acid, NaOH, thallium compound, an organo mercapto compound, and water. The presence of the organo mercapto compound in thallium containing cyanide bath permits efficient stripping of palladium from copper containing substrates with minimum corrosion damage to the substrate.

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