Coating processes – With post-treatment of coating or coating material – Swelling agent or solvent applied to treat coating
Patent
1997-10-06
1999-09-14
Dudash, Diana
Coating processes
With post-treatment of coating or coating material
Swelling agent or solvent applied to treat coating
118 52, 118 56, 134 33, 134 34, 134902, 427240, 427350, 427352, 427294, 438759, 438906, B05D 126, B05D 310, B05D 312
Patent
active
059520507
ABSTRACT:
A method for dispensing a chemical, such as an edge bead removal solvent, onto a semiconductor wafer comprising the steps of dispensing the chemical selectively onto the wafer and applying a suction to the area immediately surrounding the location at which the chemical is dispensed onto the wafer. Preferably, the suction is applied simultaneously with the dispensing of the chemical. One specific version of the invention provides an edge bead removal system wherein suction is applied to the area immediately surrounding the solvent dispensing nozzle to remove dissolved coating material and excess solvent from the wafer. In one aspect of this system, an apparatus for removing the edge bead includes a mechanism for dispensing a solvent selectively onto the edge of the wafer, and a mechanism surrounding the dispensing mechanism for vacuuming excess solvent and dissolved coating material from the edge of the wafer. The edge bead removal apparatus preferably also includes mechanisms for spinning the semiconductor wafer and coating material on the spinning wafer. Another aspect of the system provides a method for removing an edge bead of a coating of material that has been spun onto the surface of a semiconductor wafer. The method includes the steps of dispensing a solvent selectively onto the edge of the wafer to dissolve the coating material at the extreme edge of the wafer, and applying a suction to vacuum excess solvent and dissolved coating material from the wafer.
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Translation of Japanese Document 56-73579, Jun. 18, 1981.
Dudash Diana
Micro)n Technology, Inc.
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