Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-11-26
1989-11-07
Bueker, Richard
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156610, 156DIG70, 156DIG103, 118723, 118724, 118725, C23C 1600
Patent
active
048789895
ABSTRACT:
Preferred embodiments include a chemical beam epitaxy system (30) with cells for Group III compounds (44) and Group V compounds (40) for epitaxial growth of III-V semiconductor materials on a substrate (38) together with an atomic hydrogen cell (42) for scavenging carbonaceous residues during the chemical beam epitaxy growth to prevent incoporation of carbon impurities in the growing epilayer.
REFERENCES:
patent: 3801366 (1974-04-01), Lemelson
patent: 4051382 (1977-09-01), Ogawa
patent: 4239584 (1980-12-01), Chang et al.
patent: 4522674 (1985-06-01), Ninomiya
patent: 4636268 (1987-01-01), Tsang
Tsang, W. T., "Chemical Beam Epitaxy of InP and GaAs," Appl. Phys. Lett., vol. 45, No. 11 (Dec. 1, 1984) pp. 1234-1236.
Brodsky et al., IBM Tech. Dis. Bull., vol. 22, No. 8A, Jan. 1980.
Parker, The Technology and Physics of Molecular Beam Epitaxy, .COPYRGT.1985, Plenum Press, N.Y., p. 31.
Bueker Richard
Comfort James T.
Hoel Carlton H.
Sharp Melvin
Texas Instruments Incorporated
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