Chemical bath having a uniform etchant overflow

Details Chemical bath having a uniform etchant overflow Chemical bath having a uniform etchant overflow

1997-06-05

2000-06-06

Utech, Benjamin L.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C23F 102

Patent

active

060713739

ABSTRACT:
A chemical bath of an overflow-type includes an inner bath which includes a plurality of holes on its sidewalls. The holes are formed in such a manner that they are spaced apart from the upper end of the inner bath at a predetermined distance. In this chemical bath, the chemical in the inner bath flows over the upper end of the inner bath into the outer bath and is simultaneously is discharged to the outer bath through the holes. Accordingly, unless either of the opposed sidewalls slopes lower than another by over a predetermined value, the chemical can flow continuously at nearly the same rate at both sidewalls of the inner bath. This reduces the difference of the etching rate between the respective wafers caused by the difference of the position of the wafers immersed in the chemical in the inner bath and leads to an improvement in the reliability of the etching process.

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