Chemical amplification type positive resist composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S905000, C430S907000, C430S910000

Reexamination Certificate

active

10254598

ABSTRACT:
A chemical amplification type positive resist composition, which can reduce cost steeply without significantly decreasing basic abilities, is provided, and the chemical amplification type positive resist composition includes (A) a resin having a polymerization unit derived from p-hydroxystyrene and a polymerization unit of the formula (1) or formula (2)which is insoluble or poorly soluble itself in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid, (B) a resin obtained by protecting a portion of the hydroxyl groups in poly(p-hydroxystyrene) with a protective group not dissociating by the action of an acid or a resin obtained by substituting a portion of the hydroxyl groups in poly(p-hydroxystyrene) with hydrogen, and (C) an acid generating agent.

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patent: 1 091 250 (2001-04-01), None
patent: 2001-66778 (2001-03-01), None
Nozaki et al., “High etch-resistance EB resists employing adamantyl protective groups and thier application for 248 nm lithography”, Journal of Photopolymer Science and Technology, vol. 13, No. 3 (2000) p. 397-404.

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