Charge coupled devices including buried transmission gates

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

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257223, 257232, 257233, 257234, H01L 27148, H01L 29768

Patent

active

059628820

ABSTRACT:
A charge coupled device includes a substrate, a photoelectric conversion region, a hole accumulation region, a vertical charge coupled region, and a buried transmission gate region. The substrate includes a surface with a light receiving region and a charge transmission region. The photoelectric conversion region is provided in a substrate beneath the light receiving and charge transmission regions, and the photoelectric conversion region generates a photoelectric signal responsive to light received at the light receiving region of the substrate surface. The hole accumulation region is provided in the substrate between the photoelectric conversion region and the light receiving region of the substrate surface. The vertical charge coupled region is provided in the substrate between the photoelectric conversion region and the charge transmission region of the substrate surface. The buried transmission gate region is provided between the vertical charge coupled region and the photoelectric conversion region. The buried transmission gate region transfers the photoelectric signal from the photoelectric conversion region to a portion of the vertical charge coupled region opposite the substrate surface. Related methods are also disclosed.

REFERENCES:
patent: 5471246 (1995-11-01), Nishima
patent: 5581099 (1996-12-01), Kusaka et al.
patent: 5619049 (1997-04-01), Kim
patent: 5668390 (1997-09-01), Morimoto
patent: 5828091 (1998-10-01), Kawai
Ozaki et al., A High-Packing Density Pixel With Punchthrough Read-Out Method For An HDTV Interline CCD, IEEE Transactions On Electron Devices, vol. 41, No. 7, Jul. 1994, pp. 1128-1135.

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