Characterization and reduction of variation for integrated...

Computer-aided design and analysis of circuits and semiconductor – Integrated circuit design processing – Testing or evaluating

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C716S100000, C716S110000, C716S132000

Reexamination Certificate

active

08001516

ABSTRACT:
A method and system are described to reduce process variation as a result of the semiconductor processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to modify the design and manufacture of integrated circuits.

REFERENCES:
patent: 5124927 (1992-06-01), Hopewell et al.
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5581475 (1996-12-01), Majors
patent: 5597668 (1997-01-01), Nowak et al.
patent: 5655110 (1997-08-01), Krivokapic et al.
patent: 5663076 (1997-09-01), Rostoker et al.
patent: 5705301 (1998-01-01), Garza et al.
patent: 5763955 (1998-06-01), Findley et al.
patent: 5798298 (1998-08-01), Yang et al.
patent: 5821621 (1998-10-01), Jeng
patent: 5835225 (1998-11-01), Thakur
patent: 5838448 (1998-11-01), Aiyer et al.
patent: 5854125 (1998-12-01), Harvey
patent: 5861342 (1999-01-01), Gabriel et al.
patent: 5903469 (1999-05-01), Ho
patent: 5920487 (1999-07-01), Reich et al.
patent: 5923563 (1999-07-01), Lavin et al.
patent: 5923947 (1999-07-01), Sur
patent: 5948573 (1999-09-01), Takahashi
patent: 5972541 (1999-10-01), Sugasawara et al.
patent: 6049789 (2000-04-01), Frison et al.
patent: 6081272 (2000-06-01), Morimoto
patent: 6093631 (2000-07-01), Jaso
patent: 6109775 (2000-08-01), Tripathi et al.
patent: 6118137 (2000-09-01), Fulford et al.
patent: 6124197 (2000-09-01), Fulford
patent: 6157947 (2000-12-01), Watanabe et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6230299 (2001-05-01), McSherry et al.
patent: 6249904 (2001-06-01), Cobb
patent: 6255125 (2001-07-01), Schmidt et al.
patent: 6259115 (2001-07-01), You et al.
patent: 6263476 (2001-07-01), Browen et al.
patent: 6289499 (2001-09-01), Rieger et al.
patent: 6309956 (2001-10-01), Chiang et al.
patent: 6323113 (2001-11-01), Gabriel et al.
patent: 6327555 (2001-12-01), Shimizu et al.
patent: 6328872 (2001-12-01), Talieh et al.
patent: 6343370 (2002-01-01), Taoka et al.
patent: 6344408 (2002-02-01), Chen et al.
patent: 6344409 (2002-02-01), Jaso et al.
patent: 6352623 (2002-03-01), Volodarsky et al.
patent: 6355387 (2002-03-01), Fujinaga et al.
patent: 6358856 (2002-03-01), Lyons et al.
patent: 6380087 (2002-04-01), Gupta et al.
patent: 6396158 (2002-05-01), Travis
patent: 6484300 (2002-11-01), Kim et al.
patent: 6486066 (2002-11-01), Cleaves et al.
patent: 6539321 (2003-03-01), Bruce et al.
patent: 6550041 (2003-04-01), McBride
patent: 6556884 (2003-04-01), Miller et al.
patent: 6556947 (2003-04-01), Scheiner et al.
patent: 6562639 (2003-05-01), Minvielle et al.
patent: 6567964 (2003-05-01), Shin et al.
patent: 6578174 (2003-06-01), Zizzo
patent: 6578188 (2003-06-01), Pang et al.
patent: 6611045 (2003-08-01), Travis et al.
patent: 6613688 (2003-09-01), Brown et al.
patent: 6625801 (2003-09-01), Pierrat et al.
patent: 6631688 (2003-09-01), Brown et al.
patent: 6651226 (2003-11-01), Houge et al.
patent: 6660569 (2003-12-01), Barthelmess et al.
patent: 6665856 (2003-12-01), Pierrat et al.
patent: 6671570 (2003-12-01), Schulze
patent: 6691297 (2004-02-01), Misaka et al.
patent: 6704920 (2004-03-01), Brill et al.
patent: 6708129 (2004-03-01), Pasadyn et al.
patent: 6708318 (2004-03-01), Satoh et al.
patent: 6742165 (2004-05-01), Lev et al.
patent: 6751785 (2004-06-01), Oh
patent: 6781570 (2004-08-01), Arrigo et al.
patent: 6795952 (2004-09-01), Stine et al.
patent: 6866571 (2005-03-01), Held
patent: 6866974 (2005-03-01), Kim et al.
patent: 6873720 (2005-03-01), Cai et al.
patent: 6893800 (2005-05-01), Jessen et al.
patent: 6904581 (2005-06-01), Oh
patent: 7124386 (2006-10-01), Smith et al.
patent: 7152215 (2006-12-01), Smith et al.
patent: 7174520 (2007-02-01), White et al.
patent: 7243316 (2007-07-01), White et al.
patent: 7325206 (2008-01-01), White et al.
patent: 7353475 (2008-04-01), White et al.
patent: 7356783 (2008-04-01), Smith et al.
patent: 7360179 (2008-04-01), Smith et al.
patent: 7363099 (2008-04-01), Smith et al.
patent: 7363598 (2008-04-01), Smith et al.
patent: 7367008 (2008-04-01), White et al.
patent: 7380220 (2008-05-01), Smith et al.
patent: 7383521 (2008-06-01), Smith et al.
patent: 7393755 (2008-07-01), Smith et al.
patent: 2001/0031506 (2001-10-01), Plat et al.
patent: 2001/0052107 (2001-12-01), Anderson et al.
patent: 2002/0037655 (2002-03-01), Hasunuma et al.
patent: 2002/0045110 (2002-04-01), Ohnuma
patent: 2002/0051567 (2002-05-01), Ganz et al.
patent: 2002/0083401 (2002-06-01), Breiner et al.
patent: 2002/0106837 (2002-08-01), Cleeves et al.
patent: 2002/0157076 (2002-10-01), Asakawa
patent: 2002/0162082 (2002-10-01), Cwynar et al.
patent: 2003/0045100 (2003-03-01), Saka et al.
patent: 2003/0045115 (2003-03-01), Fang
patent: 2003/0084416 (2003-05-01), Dai et al.
patent: 2003/0107134 (2003-06-01), Lee
patent: 2003/0199150 (2003-10-01), Permana et al.
patent: 2003/0226757 (2003-12-01), Smith et al.
patent: 2003/0228714 (2003-12-01), Smith et al.
patent: 2003/0229410 (2003-12-01), Smith et al.
patent: 2003/0229412 (2003-12-01), White et al.
patent: 2003/0229479 (2003-12-01), Smith et al.
patent: 2003/0229868 (2003-12-01), White et al.
patent: 2003/0229875 (2003-12-01), Smith et al.
patent: 2003/0229880 (2003-12-01), White et al.
patent: 2003/0229881 (2003-12-01), White et al.
patent: 2003/0237064 (2003-12-01), White et al.
patent: 2004/0044984 (2004-03-01), Keogan et al.
patent: 2004/0058255 (2004-03-01), Jessen et al.
patent: 2004/0076896 (2004-04-01), Kim et al.
patent: 2004/0107410 (2004-06-01), Misaka et al.
patent: 2005/0037522 (2005-02-01), Smith et al.
patent: 2005/0051809 (2005-03-01), Smith et al.
patent: 2005/0132306 (2005-06-01), Smith et al.
patent: 2005/0196964 (2005-09-01), Smith et al.
patent: 2005/0235246 (2005-10-01), Smith et al.
patent: 2005/0235248 (2005-10-01), Smith et al.
patent: 2005/0238524 (2005-10-01), Smith et al.
patent: 2005/0289500 (2005-12-01), Misaka et al.
patent: 2007/0101305 (2007-05-01), Smith et al.
patent: 2007/0157139 (2007-07-01), White et al.
patent: 2007/0256039 (2007-11-01), White
patent: 2008/0160646 (2008-07-01), White et al.
patent: 2008/0162103 (2008-07-01), White et al.
patent: 2008/0163139 (2008-07-01), Scheffer et al.
patent: 2008/0163141 (2008-07-01), Scheffer et al.
patent: 2008/0163142 (2008-07-01), White et al.
patent: 2008/0163148 (2008-07-01), Scheffer et al.
patent: 2008/0163150 (2008-07-01), White et al.
patent: 2008/0216027 (2008-09-01), White et al.
patent: 2009/0031261 (2009-01-01), Smith et al.
patent: 2009/0031271 (2009-01-01), White et al.
patent: 2009/0199139 (2009-08-01), White et al.
patent: 0453753 (1991-10-01), None
patent: WO 03079240 (2003-09-01), None
Boning, D., et al., “Models for pattern dependencies: Cpaturing effects in oxide, sti, and copper cmp”, Jul. 17, 2001, Seicon West, pp. 1-38.
Boning, D., “Pattern dependent modeling for cmp optimization and control”, MRS Spring meeting, Proc. symposium P: Chemical mechanical poilshing: San Francisco, CA, Apr. 1999.
Kim, Y., et al., “CHAMPS (CHemical-Mechanical Planarization Simulator)”, International conference on Simulation of semiconductor processes and devices, Seattle, WA, Sep. 6-8, 2000., pp. 1-4.
Park, T, et al., “Electrical Characterization of copper chemical mechanical polishing”, Sematech, Austin, TX, Feb. 1999. pp. 1-8.
Mehrotra, V., et al., Modeling the effects of manufacturing varaition on high-speed microprocessor interconnect perfromance, Annual ACM IEEE design automation conference, Los Angeles, CA, 2000. pp. 168-171.
Stine, B. et al., “The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes”, IEEE Mar. 1998, pp. 665-679.
Stine, B et al., “A simulation methodology for assessing the impact of spatial/pattern dependent interconnect parameter variation on circuit performance”, 1997, International electron cevices metting, Washington, DC., Dec. 1997, pp. 133-136.
Stine, B. et al., “A closed-form analytic model for ILD thickness variation in CMP processes”, Proc. CMP-MIC, Santa Calra, CA, Feb. 1997.
Baker “Using Calibre in a

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Characterization and reduction of variation for integrated... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Characterization and reduction of variation for integrated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Characterization and reduction of variation for integrated... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2764137

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.