Ceramic substrate used for fabricating electric or electronic ci

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428210, 428901, 228121, 257750, B32B 900

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active

052138771

ABSTRACT:
A ceramic substrate is used for an electric or electronic circuit, and comprises a ceramic foundation and at least one conductive island formed of aluminum or an aluminum alloy and bonded to one surface of the ceramic foundation for providing conductive paths to circuit components connected thereto, wherein the aluminum or aluminum-alloy island is brazed to the ceramic foundation with a brazing alloy selected from the group consisting of aluminum-silicon alloy, aluminum-germanium alloy, aluminum-silicon-magnesium alloy and aluminum-silicon-germanium alloy so that thermal stress between the ceramic foundation and the conductive island is taken up.

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patent: 4781970 (1988-11-01), Barbee et al.
patent: 4979015 (1990-12-01), Stierman et al.
Patent Abstracts Of Japan, vol. 13, No. 186 (E-752) May 2, 1989 and JP-A 01 012 559 (Toshiba).
Patent Abstracts Of Japan, vol. 12, No. 54 (E-583) Feb. 18, 1988 and JP-A 62 199 038 (Hitachi Ltd.).
Patent Abstracts Of Japan, vol. 14, No. 90 (C-691) Feb. 20, 1990 and JP-A 01 301 575 (Kyocera Corp).
Patent Abstracts Of Japan, vol. 14, No. 292 (E-944) Jun. 25 1990 and JP-A 02 094 652 (Mitsubishi Metal Corp.).
Patent Abstracts Of Japan, vol. 13, No. 166 (E-746) Apr. 20 1989 and JP-A 63 318 760 (Sumitomo Electric Ind. Ltd).
Patent Abstracts Of Japan, vol. 13, No. 396 (E-815) Sep. 4 1989 and JP-A 01 140 693 (Fujitsu Ltd.).

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