Ceramic rotatable magnetron sputtering cathode target and proces

Details Ceramic rotatable magnetron sputtering cathode target and proces Ceramic rotatable magnetron sputtering cathode target and proces

1992-08-28

1994-10-11

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429821, 20429812, C23C 1434

Patent

active

053544463

ABSTRACT:
A ceramics rotatable magnetron sputtering cathode target comprising a cylindrical target holder and a ceramics layer as a target to be sputtered, formed on the outer surface of the target holder, wherein at least one layer selected from the group consisting of a layer of a metal or alloy having a thermal expansion coefficient of an intermediate level between the thermal expansion coefficients of the ceramics layer and the target holder, and a layer of a metal or alloy having a thermal expansion coefficient approximating to the thermal expansion coefficient of the ceramics layer, is formed as an undercoat between the ceramics layer and the target holder.

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