Ceramic packaged semiconductor device

Details Ceramic packaged semiconductor device Ceramic packaged semiconductor device

1982-12-10

1985-05-14

James, Andrew J.

357 67, 357 81, 357 74, 357 73, H01L 2334, H01L 2336, H01L 2314

Patent

active

045175845

ABSTRACT:
A semiconductor device with a semiconductor element encased in a hollow ceramic package. The portion of the package at which the semiconductor element is disposed is formed from a SiC-based substrate containing Be or a compound of Be with a thin SiO.sub.2 layer being capable of reacting with glass provided thereon and with a glass layer or a thin film circuit on the SiO.sub.2 layer.

REFERENCES:
patent: 3408228 (1968-10-01), Cox
patent: 3576668 (1971-04-01), Fenster et al.
patent: 3650778 (1972-03-01), Dumesnil et al.
patent: 3718608 (1973-02-01), Mason et al.
patent: 3825442 (1974-07-01), Moore
patent: 3900330 (1975-08-01), Moriguchi et al.
patent: 4073657 (1978-02-01), Davis et al.
patent: 4172109 (1979-10-01), Smoak
patent: 4352120 (1982-09-01), Kurihara et al.
patent: 4396935 (1973-08-01), Schuck

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