Ceramic multilayer wiring substrate

Details Ceramic multilayer wiring substrate Ceramic multilayer wiring substrate

1990-07-16

1992-05-05

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428209, 428210, 428195, 428433, 428457, 428901, 174255, 174256, 174257, 361411, B32B 310

Patent

active

051106540

ABSTRACT:
A ceramic multilayer wiring substrate having a stack of a plurality of ceramic sheets each being formed with through holes which are connected to one another by a conductive paste buried in said through holes. Among the ceramic sheets, those which constitute an intermediate layer portion each is formed with a plurality of parallel through holes which are spaced apart in the direction perpendicular to the direction of thickness of the ceramic sheet. With such through holes, the substrate reduces the resistance in the intermediate layer portion and, therefore, the conduction resistance of the entire through holes.

REFERENCES:
patent: 4650923 (1987-03-01), Nishigaki
patent: 4712161 (1987-12-01), Pryor
patent: 4724283 (1988-02-01), Shimada
patent: 4871608 (1989-10-01), Kondo
patent: 4984132 (1991-01-01), Sakurai

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