Ceramic electronic device and method of manufacturing the...

Details Ceramic electronic device and method of manufacturing the... Ceramic electronic device and method of manufacturing the...

2002-01-11

2004-10-26

Tucker, Philip C. (Department: 1712)

Stock material or miscellaneous articles

Composite

Of silicon containing

C428S450000, C205S183000, C205S205000, C427S430100, C427S435000, C427S443200, C361S272000, C361S320000

Reexamination Certificate

active

06808813

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a ceramic electronic device having a ceramic element and an external electrode on the ceramic element, and to a method of manufacturing the device.
BACKGROUND OF THE INVENTION
A multi-layer ceramic capacitor will be explained as a known ceramic electronic device.
FIG. 4
is a cross sectional view of a conventional multi-layer ceramic capacitor. The multi-layer ceramic capacitor
21
includes a ceramic element
24
and external electrodes
29
,
30
provided on both sides of the ceramic element
24
. The ceramic element
24
is formed through sintering alternate layers of dielectric ceramic
22
and internal electrode
23
. The external electrodes
29
,
30
include respective external electrode bases
25
,
26
connected to their corresponding internal electrodes
23
, nickel-plating layers
27
joined to the external electrode bases
25
,
26
, and solder- or tin-plating layers
28
, respectively.
A method of manufacturing the conventional multi-layer ceramic capacitor
21
will be explained.
First, the dielectric ceramics
22
and the internal electrode
23
are placed and bonded alternately one over the other, and sintered together at a high temperature, thus providing the ceramic element
24
.
Then, the ceramic element
24
has both sides to which a pattern of electrode paste is applied, and is sintered, thus providing the external electrode bases
25
,
26
. The material of the paste is identical to that of the internal electrode
23
or its alloy. Then, the nickel-plating layer
27
for improving the operational reliability and the solder-friendly characteristics is provided on each of the external electrode bases
25
,
26
. The solder- or tin-plating layer
28
is provided on the nickel-plating layer
27
, thus providing each of the external electrodes
29
and
30
. Then, a multi-layer ceramic capacitor
21
is provided.
The ceramic element
24
in the conventional multi-layer ceramic capacitor
21
may however be susceptible in its surface insulating properties to the environmental conditions. In particular, the insulating properties between the external electrodes
29
and
30
may possibly be declined under humid conditions.
Also, when the ceramic element
24
is wet at its surface with water, the solder- or tin-plating
28
may develop migration of metal, thus short-circuiting between the external electrodes
29
and
30
. The plating layer
28
may be oxidized with absorbing water, hence declining its soldering performance.
SUMMARY OF THE INVENTION
A ceramic electronic device and a method of manufacturing the device are provided. The device has an improved insulating and soldering properties thus having an increased operational reliability.
The ceramic electronic device includes a ceramic element, an external electrode provided on the ceramic element, and a protective layer provided on the ceramic element. The protective layer is formed through impregnating and dehydrating condensation of a composition expressed by R—C
n
H
2n
—Si—(OR′)
3
(where R is epoxy, alkyl, aryl, perfluoroaryl, or mixture of them, n is a natural number, and R′ is an alkyl group having 1 to 4 carbon atoms, hydrogen, or halogen atom, wherein at least one of R′ is hydrogen).


REFERENCES:
patent: 4276135 (1981-06-01), Sato et al.
patent: 4327369 (1982-04-01), Kaplan
patent: 6043330 (2000-03-01), Hacker et al.
patent: 6127040 (2000-10-01), Grobbauer et al.
patent: 0 548 996 (1993-06-01), None
patent: 10-214741 (1998-08-01), None
Machine translation of JP 10-214741, provided by the JPO website.*
Patent Abstracts of Japan, vol. 1995, No. 04, May 1995 & JP 07 014433 (Jan. 1995) *Abstract*.
Patent Abstracts of Japan, vol. 1996, No. 03, Mar. 1996 & JP 07 307243 (Nov. 1995) *Abstract*.
Patent Abstracts of Japan, vol. 003, No. 014, Feb. 1979 & JP 53 138448 (Dec. 1978) *Abstract*.

Affiliated with

Also associated with

Rating

Ceramic electronic device and method of manufacturing the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ceramic electronic device and method of manufacturing the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic electronic device and method of manufacturing the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3274655