Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1992-07-10
1994-07-12
Ryan, Patrick J.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428901, 428688, 428210, 361772, B32B 900
Patent
active
053287517
ABSTRACT:
This invention provides a ceramic circuit board comprising: a ceramic base board; a metal circuit plate integrally bonded onto a surface of the ceramic base board; a terminal connecting port formed by bending a part of the metal circuit plate for connecting a terminal of a module, the terminal connecting port being formed so that the terminal connecting port is raised from a surface of the ceramic base board, and a curvature radius of the bent portion provided on the terminal connecting port is set to 0.2 mm or more. An empty communication hole such as groove or through hole may also be formed at a bonding surface between the metal circuit plate and the ceramic base board.
REFERENCES:
patent: 4497875 (1985-02-01), Arakawa et al.
patent: 4704320 (1987-11-01), Mizunoya et al.
patent: 4910643 (1990-03-01), Williams
patent: 4939022 (1990-07-01), Palanisamy
patent: 4954386 (1990-09-01), Mizunoya et al.
patent: 5019187 (1991-05-01), Iyogi
Coombs, "Printed Circuit Handbook," McGraw Hill 1988, pp. 3.1-3.26, 29.14.
Patent Abstracts of Japan, vol. 15, No. 367(E-1112)(4895), Sep. 17, 1991, & JP-03-145-748, Kazuya Matsuura, et al., "Ceramic Circuit Board".
Patent Abstracts of Japan, vol. 10, No. 8(E-373)(2065), Jan. 14, 1986, & JP-60-171-763, Tetsuo Morita, "Connection Structure of Ceramic Circuit Board and Lead Terminal".
Patent Abstracts of Japan, vol. 13, No. 592(c-671)(3940), Dec. 26, 1989, & JP-1-249-669, Yutaka Komorida, et al., "Ceramic Circuit Board".
Patent Abstracts of Japan, vol. 15, No. 152(E-1057) (4680), Apr. 17, 1991, & JP-3-027-590, Kunimitsu Yoshikawa, "Ceramic Circuit Board".
Patent Abstracts of Japan, vol. 16, No. 108(E-1179) (5151), Mar. 17, 1992, & JP-3-283-554, Yuji Yokomizo, "Hybrid Integrated Circuit".
Patent Abstracts of Japan, vol. 15, No. 334(E-1104) (4862), Aug. 26, 1991, & JP-3-126-287, Yutaka Komorida, et al., "Printed Circuit Board".
Ikeda Kazuo
Komorita Hiroshi
Matsumura Kazuo
Mizunoya Nobuyuki
Naba Takayuki
Jewik Patrick
Kabushiki Kaisha Toshiba
Ryan Patrick J.
LandOfFree
Ceramic circuit board with a curved lead terminal does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ceramic circuit board with a curved lead terminal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic circuit board with a curved lead terminal will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-395007