Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1994-12-28
1997-09-30
Kincaid, Kristine L.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
361768, 257739, H01L 2300
Patent
active
056728484
ABSTRACT:
A ceramic circuit board wherein a copper circuit plate is directly bonded at a predetermined position on a ceramic substrate and heat is applied; or the copper circuit plate is integrally bonded through a brazing material containing an active metal, such as Ti, Zr and Hf; and a semiconductor element is bonded onto a semiconductor element mounting portion of the copper circuit plate through a solder layer. The copper plate element is formed with grooves or holes thereon and is bonded on the semiconductor element mounting portion of the copper circuit plate, and the semiconductor element is integrally bonded onto a surface of a grooved or holed side of the copper plate element through a solder layer. By the above structure, the ceramic circuit board prevents solder voids when soldering the semiconductor element onto the copper circuit plate, thereby reducing the dispersion of the thermal resistance values between the semiconductor element and the ceramic substrate, and reducing or mitigating the thermal stress applied or acting on the mounting portion of the semiconductor element.
REFERENCES:
patent: 5281770 (1994-01-01), Kamei et al.
patent: 5420377 (1995-05-01), Bresin et al.
Hino Takashi
Komorita Hiroshi
Naba Takayuki
Tanaka Tadashi
Ghosh Paramita
Kabushiki Kaisha Toshiba
Kincaid Kristine L.
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