Centrifugal method for filing high aspect ratio blind mirco...

Coating processes – Centrifugal force utilized

Reexamination Certificate

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C427S256000, C427S282000, C427S287000, C427S294000, C427S346000, C427S356000, C427S368000, C427S425000, C118S050000, C118S052000, C118S054000, C118S057000, C118S107000, C118S301000, C118S320000

Reexamination Certificate

active

07815968

ABSTRACT:
The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.

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