Centering/positioning apparatus for wafer and vacuum chuck

Details Centering/positioning apparatus for wafer and vacuum chuck Centering/positioning apparatus for wafer and vacuum chuck

1986-06-09

1987-07-28

Weidenfeld, Gil

Metal working

Means to assemble or disassemble

Means comprising hand manipulatable tool

292816, 29468, 33655, G01B 330

Patent

active

046823964

ABSTRACT:
A method for centering a semiconductor wafer on a vacuum chuck having a centered shaft. A shaft centering tool which is contained in pre-existing openings in a housing surrounding the shaft is used to define the desired location of the shaft. A second device having the same circumference as the wafer, is employed on the chuck in order that teflon guides can be set into position around the chuck. Once the guides are set, wafers introduced into the guides will be centered on the chuck.

REFERENCES:
patent: 1224069 (1917-04-01), Clayton
patent: 4212098 (1980-07-01), Sand
patent: 4295276 (1981-10-01), Ellington, III
patent: 4343992 (1982-08-01), Blaser

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