Centering/positioning apparatus for wafer and vacuum chuck

Details Centering/positioning apparatus for wafer and vacuum chuck Centering/positioning apparatus for wafer and vacuum chuck

1985-05-03

1987-04-21

Weidenfeld, Gil

Chucks or sockets

With fluid-pressure actuator

Socket type

279 3, 33655, B23B 3100, G01B 508

Patent

active

046590943

ABSTRACT:
A method for centering a semiconductor wafer on a vacuum chuck having a centered shaft. A shaft centering tool which is contained in pre-existing openings in a housing surrounding the shaft is used to define the desired location of the shaft. A second device having the same circumference as the wafer, is employed on the chuck in order that teflon guides can be set into position around the chuck. Once the guides are set, wafers introduced into the guides will be centered on the chuck.

REFERENCES:
patent: 610021 (1898-08-01), Bogart
patent: 2166650 (1939-07-01), Townsend
patent: 3046671 (1962-07-01), Moores
patent: 3276136 (1966-10-01), Testa
patent: 4258928 (1981-03-01), Wiesler
"Centering Chuck System," IBM Technical Disclosure Bulletin, vol. 21, No. 7, Dec. 1978, pp. 2770-2771.

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