Center pad type IC chip with jumpers, method of processing...

Details Center pad type IC chip with jumpers, method of processing... Center pad type IC chip with jumpers, method of processing...

2007-05-29

2007-05-29

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

Reexamination Certificate

active

10269328

ABSTRACT:
A center pad type integrated circuit chip and a method of forming the same is presented. The chip comprises an integrated circuit chip having chip pads formed on a center region thereof and a jumper. The jumper includes a buffer layer arranged adjacent to a side of the chip pads and a plurality of jump metal lines formed on the buffer layer. The jump metal lines are spaced apart from each other.

REFERENCES:
patent: 6140149 (2000-10-01), Wark
patent: 6175159 (2001-01-01), Sasaki
patent: 6583511 (2003-06-01), Michii et al.
patent: 2002/0053727 (2002-05-01), Kimura
patent: 2002/0121695 (2002-09-01), Stephenson et al.
patent: 2003/0057570 (2003-03-01), Ball
patent: 2004/0262757 (2004-12-01), Kinsman et al.
patent: 10-256293 (1998-09-01), None
patent: 11-260851 (1999-09-01), None
patent: 11-040743 (1999-12-01), None
patent: 1020000003753 (2000-01-01), None
patent: 1020010026512 (2001-04-01), None
English language abstract for Korean Publication No. 1020000003753.
English language abstract for Korean Publication No. 1020010026512.
English language abstract for Japan Publication No. 10-256293.
English language abstract for Japan Publication No. 11-260851.
English language abstract for Japan Publication No. 11-040743.

Affiliated with

Also associated with

Rating

Center pad type IC chip with jumpers, method of processing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Center pad type IC chip with jumpers, method of processing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Center pad type IC chip with jumpers, method of processing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3759990