Cavity-up-cavity-down multichip integrated circuit package

Details Cavity-up-cavity-down multichip integrated circuit package Cavity-up-cavity-down multichip integrated circuit package

1988-06-06

1989-02-21

James, Andrew J.

357 75, 357 80, H01L 2302, H01L 2308, H01L 2310, H01L 2312

Patent

active

048070190

ABSTRACT:
A multichip integrated circuit package comprises a thin planar body which has top and bottom major surfaces. Conductors, for carrying electrical signals, are integrated into the body and include input/output terminals on one portion of the bottom surface. Downward-facing cavities for holding respective high power integrated circuit chips extend from another portion of the bottom surface into the body, and upward-facing cavities for holding respective low power integrated circuits extend from the top surface into the body. Small thermal resistance for the high power chips is achieved, and footprint is simultaneously minimized by locating the upward-facing cavities over the terminals.

REFERENCES:
patent: 4445274 (1984-05-01), Suzuki et al.
patent: 4614194 (1986-09-01), Jones et al.
patent: 4616655 (1986-10-01), Weinberg et al.

Affiliated with

Also associated with

Rating

Cavity-up-cavity-down multichip integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cavity-up-cavity-down multichip integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cavity-up-cavity-down multichip integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1526568