Carrier head with edge control for chemical mechanical polishing

Abrading – Machine – Rotary tool

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

451398, 451 41, B24B 722

Patent

active

061322989

ABSTRACT:
A carrier head, particularly suited for chemical mechanical polishing of a flatted substrate, includes a flexible membrane and an edge load ring. A lower surface of the flexible membrane provides a receiving surface for a center portion of the substrate, whereas a lower surface of the edge load ring provides a receiving surface for a perimeter portion of the substrate. A slurry suitable for chemical mechanical polishing a flatted substrate includes water, a colloidal silica that tends to agglomerate, and a fumed silica that tends not to agglomerate.

REFERENCES:
patent: 4918869 (1990-04-01), Kitta
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5423558 (1995-06-01), Koeth et al.
patent: 5423716 (1995-06-01), Strasbaugh
patent: 5527209 (1996-06-01), Volodarsky et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5624299 (1997-04-01), Shendon
patent: 5643053 (1997-07-01), Shendon
patent: 5643061 (1997-07-01), Jackson et al.
patent: 5695392 (1997-12-01), Kim
patent: 5720845 (1998-02-01), Liu
patent: 5733182 (1998-03-01), Muramatsu et al.
patent: 5762539 (1998-06-01), Nakashiba et al.
patent: 5803799 (1998-09-01), Volodarsky et al.
patent: 5851140 (1998-12-01), Barns et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Carrier head with edge control for chemical mechanical polishing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Carrier head with edge control for chemical mechanical polishing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carrier head with edge control for chemical mechanical polishing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-463128

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.