Abrading – Machine – Rotary tool
Reexamination Certificate
2007-12-04
2007-12-04
Eley, Timothy V. (Department: 3724)
Abrading
Machine
Rotary tool
C451S288000, C451S397000, C451S402000
Reexamination Certificate
active
10959113
ABSTRACT:
A carrier head of a chemical mechanical polishing apparatus has a support, an elastic membrane secured to the support and spaced from the bottom surface of the support so that a pressure chamber is defined between the membrane and the bottom surface of the support; and at least one annular barrier of elastic material extending from the bottom surface of the support. Each barrier has an annular partition portion that extends through the pressure chamber and divides the pressure chamber into respective pressure zones on opposite sides thereof, and an annular contact portion that abuts the membrane such that the barrier contacts the membrane but is not fixedly attached thereto. The contact portion includes a pair of annular flanges extending laterally in opposite directions at the lower end of the partition portion.
REFERENCES:
patent: 5423716 (1995-06-01), Strasbaugh
patent: 5916016 (1999-06-01), Bothra
patent: 5964653 (1999-10-01), Perlov et al.
patent: 6210255 (2001-04-01), Zuniga et al.
patent: 6361419 (2002-03-01), Zuniga et al.
patent: 6390905 (2002-05-01), Korovin et al.
patent: 6979250 (2005-12-01), Zuniga et al.
patent: 7033260 (2006-04-01), Togawa et al.
patent: 7101271 (2006-09-01), Moon
patent: 7140956 (2006-11-01), Korovin et al.
patent: 11-226865 (1999-08-01), None
patent: 10-2002-7012953 (2003-03-01), None
Boo Jae-Phil
Lee Jue-Young
Eley Timothy V.
Samsung Electronics Co,. Ltd.
Volentine & Whitt PLLC
LandOfFree
Carrier head of chemical mechanical polishing apparatus... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Carrier head of chemical mechanical polishing apparatus..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carrier head of chemical mechanical polishing apparatus... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3879456