Abrading – Abrading process – With tool treating or forming
Patent
1998-06-04
2000-02-01
Eley, Timothy V.
Abrading
Abrading process
With tool treating or forming
451288, 451398, B24B 100, B24B 2900
Patent
active
060196718
ABSTRACT:
A chemical mechanical polishing apparatus polishes the surface of a substrate to remove material therefrom. The apparatus includes a carrier, which positions the substrate against the rotating polishing pad. The carrier includes an integral loading member therein, which controls the load force of the substrate against the polishing pad. Multiple substrates may be simultaneously polished on a single rotating polishing pad, and the polishing pad may be rotationally oscillated to reduce the likelihood that any contaminants are transferred from one substrate to another along the polishing pad. A multi-lobed groove in the polishing may be used, in junction with a moving substrate, to polish the surface of the substrate.
REFERENCES:
patent: 3559346 (1971-02-01), Paola
patent: 3579917 (1971-05-01), Boettcher et al.
patent: 3731435 (1973-05-01), Boettcher et al.
patent: 3913271 (1975-10-01), Boettcher et al.
patent: 3962832 (1976-06-01), Stasbaugh
patent: 4256535 (1981-03-01), Banks
patent: 4270314 (1981-06-01), Cesna
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4373991 (1983-02-01), Banks
patent: 4811522 (1989-03-01), Gill, Jr.
patent: 4897966 (1990-02-01), Takahashi
patent: 4918869 (1990-04-01), Kitta
patent: 4918870 (1990-04-01), Torbert et al.
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5095661 (1992-03-01), Gill, Jr. et al.
patent: 5193316 (1993-03-01), Olmstead
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5230184 (1993-07-01), Bukhman
patent: 5255474 (1993-10-01), Gawa et al.
patent: 5398459 (1995-03-01), Okumura et al.
patent: 5423558 (1995-06-01), Koeth et al.
patent: 5423716 (1995-06-01), Strasbough
patent: 5441444 (1995-08-01), Nakajima
patent: 5449316 (1995-09-01), Strasbaugh
patent: 5476414 (1995-12-01), Hirose et al.
patent: 5498199 (1996-03-01), Karlsrud et al.
patent: 5527209 (1996-06-01), Volodarsky et al.
patent: 5584746 (1996-12-01), Tanaka et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5588902 (1996-12-01), Tominaga et al.
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5624299 (1997-04-01), Shendon
patent: 5643053 (1997-07-01), Shendon
patent: 5643061 (1997-07-01), Jackson et al.
patent: 5681215 (1997-10-01), Sherwood et al.
patent: 5733182 (1998-03-01), Muramatsu et al.
Applied Materials Inc.
Eley Timothy V.
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