Carrier head design for a chemical mechanical polishing apparatu

Abrading – Work holder – Vacuum

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

451288, 451289, 451398, B24B 502, B24B 2902

Patent

active

056812159

ABSTRACT:
A carrier uses multiple bellows to form two pressure chambers between the housing and carrier base and retaining ring assembly. By pressurizing the first chamber, an even load can be applied across the substrate. By pressurizing the second chamber, the retaining ring can pressed against the polishing pad. The bellows allow the carrier base to pivot with respect to the housing, but the downward force is evenly applied to the substrate through the first pressure chamber. Torque is transferred from the carrier housing to the carrier base through the bellows.

REFERENCES:
patent: 3559346 (1971-02-01), Paola
patent: 3731435 (1973-05-01), Boettcher et al.
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4373991 (1983-02-01), Banks
patent: 4435247 (1984-03-01), Basi et al.
patent: 4519168 (1985-05-01), Cesna
patent: 4600469 (1986-07-01), Fusco et al.
patent: 4944119 (1990-07-01), Gill, Jr. et al.
patent: 4954142 (1990-09-01), Carr et al.
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5095661 (1992-03-01), Gill, Jr. et al.
patent: 5193316 (1993-03-01), Olmstead
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5230184 (1993-07-01), Bukhman
patent: 5232875 (1993-08-01), Tuttle et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Carrier head design for a chemical mechanical polishing apparatu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Carrier head design for a chemical mechanical polishing apparatu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Carrier head design for a chemical mechanical polishing apparatu will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1022049

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.