Carbonation of pH controlled KOH solution for improved...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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C451S285000, C451S287000, C438S691000

Reexamination Certificate

active

07040966

ABSTRACT:
A method and polishing system for planarizing a substrate having one or more materials formed thereon. The method generally includes positioning the substrate in proximity with a polishing pad, dispensing a polishing fluid to the polishing pad, the polishing fluid being subjected to carbonation prior to being dispensed to the polishing pad, and polishing the substrate. The polishing system generally includes a polishing platen having a polishing pad disposed thereon and in proximity to the substrate, a controller configured to cause the polishing pad to contact the substrate, and a polishing fluid delivery system to deliver a polishing fluid to the polishing pad, the polishing fluid delivery system including a carbonation system.

REFERENCES:
patent: 5759378 (1998-06-01), Ferrier et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6194317 (2001-02-01), Kaisaki et al.
patent: 6234870 (2001-05-01), Uzoh et al.
patent: 6238592 (2001-05-01), Hardy et al.
patent: 6355565 (2002-03-01), Feeney et al.
patent: 2001/0008800 (2001-07-01), Koch
patent: 2003/0087524 (2003-05-01), Aoki et al.

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