Carbon nanotube reinforced metallic layer

Details Carbon nanotube reinforced metallic layer Carbon nanotube reinforced metallic layer

2007-09-11

2007-09-11

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S676000, C438S678000, C438S679000, C257SE21006, C257SE21170, C257SE51040

Reexamination Certificate

active

11292690

ABSTRACT:
A method and apparatus including an interconnect structure having a surface, a plurality of nanotubes disposed adjacent to the surface, and a metallic layer disposed adjacent to the surface and substantially including the nanotubes. An assembly may include a first embodiment of an apparatus as described, and may further include a second such embodiment at least one of physically and electrically coupled to the first embodiment.

REFERENCES:
patent: 6706402 (2004-03-01), Rueckes et al.
patent: 6982519 (2006-01-01), Guillorn et al.
patent: 2005/0101112 (2005-05-01), Rueckes et al.
patent: 2005/0128788 (2005-06-01), Segal et al.
patent: 2005/0167655 (2005-08-01), Furukawa et al.
patent: 2005/0266627 (2005-12-01), Furukawa et al.
patent: 2006/0068107 (2006-03-01), Madou et al.

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