Carbon nanotube bond pad structure and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C257S774000, C257SE23165, C977S742000, C977S932000

Reexamination Certificate

active

07872352

ABSTRACT:
A bond pad structure (300) for an integrated circuit (IC) device uses carbon nanotubes to increase the strength and resilience of wire bonds (360). In an example embodiment there is, a bond pad structure (300) on an IC substrate, the bond pad structure comprises, a first conductive layer (310) having a top surface and a bottom surface, the bottom surface attached to the IC substrate. A dielectric layer (320) is deposited on the top surface of the first conductive layer (310), the dielectric layer having an array of vias (325), the array of vias filled with a carbon nanotube material (325), the carbon nanotube material (325) is electrically coupled to the first conductive layer (310). There is a second conductive layer (330) having a top surface and a bottom surface, the bottom surface of the second conductive layer is electrically coupled to the carbon nanotube material (325). A feature of this embodiment may include the first (410,510) or second (430, 530) conductive layer being comprised of carbon nanotube material, as well.

REFERENCES:
patent: 5287002 (1994-02-01), Freeman, Jr. et al.
patent: 6146227 (2000-11-01), Mancevski
patent: 6837928 (2005-01-01), Zhang et al.
patent: 6855603 (2005-02-01), Choi et al.
patent: 7135773 (2006-11-01), Furukawa et al.
patent: 7229909 (2007-06-01), Furukawa et al.
patent: 7335603 (2008-02-01), Mancevski
patent: 7348675 (2008-03-01), Dubin et al.
patent: 7679180 (2010-03-01), Tsao et al.
patent: 2001/0023986 (2001-09-01), Mancevski
patent: 2003/0211724 (2003-11-01), Haase
patent: 2004/0169281 (2004-09-01), Nguyen et al.
patent: 2004/0253805 (2004-12-01), Dubin et al.
patent: 2005/0110145 (2005-05-01), Elers
patent: 2005/0196950 (2005-09-01), Steinhogl et al.
patent: 2005/0215049 (2005-09-01), Horibe et al.
patent: 2006/0180941 (2006-08-01), Kirby et al.
patent: 0157917 (2001-08-01), None
patent: WO-2004/075288 (2004-09-01), None
International Bureau of WIPO—European Patent Office (Search Authority), PCT International Preliminary Report on Patentability—Written Opinion of the International Searching Authority, Sep. 28, 2007, 6 pages, International Application No. PCT/IB2006/050929, Munich.
European Patent Office, Communication Pursuant to Article 94(3) EPC, Feb. 5, 2009, 2 pages, Application No. 06727747.5-2203, Munich.
European Patent Office, Office action dated Jun. 7, 2010, Application No. 06727747.5-2203/1866962, 4 pages.
Ngo, Quoc, et al., Electron Transport Through Metal-Multiwall Carbon Nanotube Interfaces,IEEE Transactions on Nanotechnology, vol. 3, No. 2, Jun. 2004, 7 pages.
Kreupl, F., et al., “Carbon Nanotubes in Interconnect Applications,” Microelectronic Engineering 64 (2002) 399-408, Elsevier Science B.V., PII: S0167-9317(02) 00814-6, 10 pages.

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