Capture compounds for electronic plating compositions and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S678000, C438S677000

Reexamination Certificate

active

06916741

ABSTRACT:
The invention relates to use of capture compounds such as a crown ether to facilitate selected compositions and processes employed in manufacture of electronic packaging devices such as printed circuit boards, semiconductor integrated circuit systems, multichip modules, lead frames and other interconnection devices, flat panel display substrates, and the like.

REFERENCES:
patent: 4636441 (1987-01-01), Sirinyan et al.
patent: 5059243 (1991-10-01), Jagannathan et al.
patent: 5389496 (1995-02-01), Calvert et al.
patent: 5468597 (1995-11-01), Calabrese et al.

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