Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-10-10
2006-10-10
Ngô, Ngân V. (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S763000, C438S778000
Reexamination Certificate
active
07119019
ABSTRACT:
Capping of copper structures in hydrophobic interlayer dielectric layer, using aqueous electro-less bath is described herein.
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Brask Justin K.
O'Brien Kevin P.
Ngo Ngan V.
Schwabe Williamson & Wyatt P.C.
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