Capacitors integrated with inductive components

Details Capacitors integrated with inductive components Capacitors integrated with inductive components

2007-04-10

2007-04-10

Do, Thuan (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000

Reexamination Certificate

active

10894521

ABSTRACT:
Techniques for producing integrated capacitors are disclosed. According to one of the techniques, one or more layers are introduced in conjunction with a ground layer supporting a substrate on which various components are realized. Depending on the use of an integrated capacitor, micro capacitors can be formed between one introduced layer and the ground layer or between two introduced layers. As all micro capacitors are connected in parallel, an integrated capacitor with usable capacitance is thus produced without occupying an extra space that would otherwise increase the size of the silicon chip. In addition, with proper connections, an interdigitated capacitor can be formed as well.

REFERENCES:
patent: 2003/0200509 (2003-10-01), Takabayashi et al.

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