Capacitor for use in DRAM cell using surface oxidized silicon no

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257534, H01L 2704, H01L 27108

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active

055127681

ABSTRACT:
A MOST capacitor structure in accordance with the invention is formed by using surface oxidized silicon nodules after metal etching to define polysilicon pillars with annular cross sections and with diameters of 0.05 to 0.2 microns.

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