Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent
1994-03-18
1996-04-30
Monin, Jr., Donald L.
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
257534, H01L 2704, H01L 27108
Patent
active
055127681
ABSTRACT:
A MOST capacitor structure in accordance with the invention is formed by using surface oxidized silicon nodules after metal etching to define polysilicon pillars with annular cross sections and with diameters of 0.05 to 0.2 microns.
REFERENCES:
patent: 4859622 (1989-08-01), Eguchi
patent: 5068199 (1991-11-01), Sandhu
patent: 5110752 (1992-05-01), Lu
patent: 5134086 (1992-07-01), Ahn et al.
patent: 5158905 (1992-10-01), Ahn
patent: 5164881 (1992-11-01), Ahn
patent: 5182232 (1993-01-01), Chhabra et al.
patent: 5204280 (1993-04-01), Dhong et al.
patent: 5213992 (1993-05-01), Lu
patent: 5227322 (1993-07-01), Ko et al.
patent: 5244842 (1993-09-01), Cathey et al.
patent: 5254503 (1993-10-01), Kenney
patent: 5256587 (1993-10-01), Jun et al.
patent: 5302540 (1994-04-01), Ko et al.
patent: 5304828 (1994-04-01), Kim et al.
patent: 5308786 (1994-05-01), Lur et al.
patent: 5313100 (1994-05-01), Ishii et al.
patent: 5332696 (1994-06-01), Kim et al.
patent: 5342800 (1994-08-01), Jun et al.
patent: 5350707 (1994-09-01), Ko et al.
Wolf et al., Silicon Processing For the VLSI Era, vol. 1, Lattice Press 1986, pp. 400-401, 581.
Jun et al., The Fabrication and Electrical Properties of Modulated Stacked Capacitor for Advanced DRAM Applications, IEEE (1992).
IBM Technical Disclosure, Method of Increasing Capacitance Area Using RIE Selectivity, vol. 35, No. 7 (Dec. 1992).
Liu Johnson
Lur Water
Wu Jiunn-Yuan
Monin, Jr. Donald L.
United Microelectronics Corporation
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