Capacitor for a semiconductor device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S303000, C257S306000

Reexamination Certificate

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06847077

ABSTRACT:
A semiconductor device having a capacitor integrated in a damascene structure. In one embodiment, the capacitor is formed entirely within a metallization layer of a damascene structure, having therein a semiconductor device component. Preferably, the capacitor is formed within a trench, having been etched in the dielectric material of the metal layer and the capacitor includes a first capacitor electrode formed within the recess in electrical contact with the device component of the metallization layer. An insulator may be formed over the first capacitor electrode, with a second capacitor electrode formed over the insulator. These elements are preferably conformally deposited within the trench, thereby forming a recess, a portion of which extends within the trench. A subsequently fabricated device component may then be placed in electrical contact with the second capacitor electrode.

REFERENCES:
patent: 5343354 (1994-08-01), Lee et al.
patent: 5973348 (1999-10-01), Ishibashi
patent: 6153510 (2000-11-01), Ishibashi
patent: 6165863 (2000-12-01), Lee et al.
patent: 6261964 (2001-07-01), Wu et al.
patent: 6309975 (2001-10-01), Wu et al.
patent: 6426544 (2002-07-01), Ryan et al.
patent: 6445564 (2002-09-01), Naitoh
patent: 6524908 (2003-02-01), Cabral et al.

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