Capacitor constructions with enhanced surface area

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S532000

Reexamination Certificate

active

10050334

ABSTRACT:
A capacitor fabrication method may include forming a first capacitor electrode over a substrate, the first electrode having an inner surface area per unit area and an outer surface area per unit area that are both greater than an outer surface area per unit area of the substrate. A capacitor dielectric layer and a second capacitor electrode may be formed over the dielectric layer. The method may further include forming rugged polysilicon over the substrate, the first electrode being over the rugged polysilicon. Accordingly, the outer surface area of the first electrode can be at least 30% greater than the outer surface area of the substrate without the first electrode including polysilicon.

REFERENCES:
patent: 5006956 (1991-04-01), Kawakita et al.
patent: 5126283 (1992-06-01), Pintchovski et al.
patent: 5187637 (1993-02-01), Embree
patent: 5316982 (1994-05-01), Taniguchi
patent: 5432732 (1995-07-01), Ohmi
patent: 5444013 (1995-08-01), Akram et al.
patent: 5452178 (1995-09-01), Emesh et al.
patent: 5625233 (1997-04-01), Cabral, Jr. et al.
patent: 5641984 (1997-06-01), Aftergut et al.
patent: 5811344 (1998-09-01), Tu et al.
patent: 5885882 (1999-03-01), Schugraf et al.
patent: 5899725 (1999-05-01), Harshfield
patent: 5905280 (1999-05-01), Liu et al.
patent: 5972769 (1999-10-01), Tsu et al.
patent: 6033967 (2000-03-01), Li et al.
patent: 6069053 (2000-05-01), Ping et al.
patent: 6104049 (2000-08-01), Solayappan et al.
patent: 6124158 (2000-09-01), Dautartas et al.
patent: 6144060 (2000-11-01), Park et al.
patent: 6156606 (2000-12-01), Michaells
patent: 6174770 (2001-01-01), Chi
patent: 6180447 (2001-01-01), Park et al.
patent: 6180481 (2001-01-01), Deboer et al.
patent: 6204070 (2001-03-01), Kim
patent: 6204172 (2001-03-01), Marsh
patent: 6207487 (2001-03-01), Kim et al.
patent: 6207561 (2001-03-01), Hwang et al.
patent: 6218256 (2001-04-01), Agarwal
patent: 6218260 (2001-04-01), Lee et al.
patent: 6222722 (2001-04-01), Fukuzumi et al.
patent: 6242299 (2001-06-01), Hickert
patent: 6249056 (2001-06-01), Kwon
patent: 6262469 (2001-07-01), Le et al.
patent: 6270572 (2001-08-01), Kim et al.
patent: 6274428 (2001-08-01), Wu
patent: 6281142 (2001-08-01), Basceri et al.
patent: 6281543 (2001-08-01), Al-Shareef et al.
patent: 6291289 (2001-09-01), Rhodes et al.
patent: 6291850 (2001-09-01), Choi et al.
patent: 6307730 (2001-10-01), Yamanishi
patent: 6309923 (2001-10-01), Tseng
patent: 6335240 (2002-01-01), Kim et al.
patent: 6355519 (2002-03-01), Lee
patent: 6359295 (2002-03-01), Lee et al.
patent: 6363691 (2002-04-01), Flaherty
patent: 6391803 (2002-05-01), Kim et al.
patent: 6403156 (2002-06-01), Jang
patent: 6420230 (2002-07-01), Derderian
patent: 6458416 (2002-10-01), Derderian et al.
patent: 6583441 (2003-06-01), Moradi et al.
patent: 6596583 (2003-07-01), Agarwal et al.
patent: 6596602 (2003-07-01), Lizuka et al.
patent: 6627462 (2003-09-01), Yang et al.
patent: 6664186 (2003-12-01), Callegari et al.
patent: 6730163 (2004-05-01), Vaartstra
patent: 6746930 (2004-06-01), Yang
patent: 6780704 (2004-08-01), Raaijmakers et al.
patent: 6800892 (2004-10-01), Bhattacharyya
patent: 6809212 (2004-10-01), Meiere et al.
patent: 6824816 (2004-11-01), Aaltonen et al.
patent: 6849505 (2005-02-01), Lee et al.
patent: 6881260 (2005-04-01), Marsh et al.
patent: 6946342 (2005-09-01), Yeo et al.
patent: 7018469 (2006-03-01), Li et al.
patent: 2001/0023110 (2001-09-01), Fukuzumi et al.
patent: 2001/0024387 (2001-09-01), Raaijmakers et al.
patent: 2002/0064915 (2002-05-01), Kitamura
patent: 2002/0109198 (2002-08-01), Yang et al.
patent: 2002/0142488 (2002-10-01), Hong
patent: 2002/0153579 (2002-10-01), Yamamoto
patent: 2002/0182820 (2002-12-01), Choi et al.
patent: 2002/0197744 (2002-12-01), Lee
patent: 2003/0215960 (2003-11-01), Mitsuhashi
patent: 2004/0018747 (2004-01-01), Lee et al.
patent: 2004/0125541 (2004-07-01), Chung
patent: 2005/0082593 (2005-04-01), Lee et al.
patent: 1 508 906 (2005-02-01), None
patent: 2002/222934 (2002-08-01), None
patent: 2002002157 (2002-01-01), None
patent: 2002046433 (2003-05-01), None
U.S. Appl. No. 09/590,795, filed Jun. 2000, Agarwal et al.
A. W. Ott, et al., “Atomic Layer Controlled Deposition of Al2O3Films Using Binary Reaction Sequence Chemistry”, Applied Surface Science (107), 1996, pp. 128-136.
U.S. Appl. No. 09/653,149, filed Aug. 31, 2000, Derderian.
U.S. Appl. No. 09/652,532, filed Aug. 31, 2000, Derderian.
U.S. Appl. No. 10/624,340, filed Jul. 2003, McClure.
U.S. Appl. No. 09/653,149, filed Aug. 2000, Derderian.
Ritala et al.;Perfectly Conformal TiN and Al203 Films Deposited by Atomic Layer Deposition; Chemical Vapor Deposition, v. 5, No. 1, 1999, pp. 7-9.

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